An official website of the United States government
The .gov means it’s official.
Federal government websites often end in .gov or .mil. Before
sharing sensitive information, make sure you’re on a federal
government site.
The site is secure.
The https:// ensures that you are connecting to the
official website and that any information you provide is encrypted
and transmitted securely.
Fonollosa J, Campos L, Martí M, de la Maza A, Parra JL, Coderch L.Fonollosa J, et al. Among authors: parra jl.Chem Phys Lipids. 2004 Jul;130(2):159-66. doi: 10.1016/j.chemphyslip.2004.03.003.Chem Phys Lipids. 2004.PMID: 15172832
Martí M, Barsukov LI, Fonollosa J, Parra JL, Sukhanov SV, Coderch L.Martí M, et al. Among authors: parra jl.Langmuir. 2004 Apr 13;20(8):3068-73. doi: 10.1021/la030385+.Langmuir. 2004.PMID: 15875831
Méndez S, Martí M, Barba C, Parra JL, Coderch L.Méndez S, et al. Among authors: parra jl.Langmuir. 2007 Jan 30;23(3):1359-64. doi: 10.1021/la0621315.Langmuir. 2007.PMID: 17241059
Coderch L, Méndez S, Martí M, Pons R, Parra JL.Coderch L, et al. Among authors: parra jl.Colloids Surf B Biointerfaces. 2007 Oct 15;60(1):89-94. doi: 10.1016/j.colsurfb.2007.06.014. Epub 2007 Jun 17.Colloids Surf B Biointerfaces. 2007.PMID: 17643969
de la Maza A, Lopez O, Cocera M, Coderch L, Parra JL.de la Maza A, et al. Among authors: parra jl.Chem Phys Lipids. 1998 Aug;94(2):181-91. doi: 10.1016/s0009-3084(98)00051-6.Chem Phys Lipids. 1998.PMID: 9779585
de Pera M, Coderch L, Fonollosa J, de la Maza A, Parra JL.de Pera M, et al. Among authors: parra jl.Skin Pharmacol Appl Skin Physiol. 2000 May-Aug;13(3-4):188-95. doi: 10.1159/000029925.Skin Pharmacol Appl Skin Physiol. 2000.PMID: 10859538Clinical Trial.
Ramírez R, Martí M, Cavaco-Paulo A, Silva R, de la Maza A, Parra JL, Coderch L.Ramírez R, et al. Among authors: parra jl.J Liposome Res. 2009;19(1):77-83. doi: 10.1080/08982100802538838.J Liposome Res. 2009.PMID: 19515010Free article.
Méndez S, Barba C, Lanzilotta AR, Kelly R, Parra JL, Coderch L.Méndez S, et al. Among authors: parra jl.Skin Res Technol. 2008 Nov;14(4):448-53. doi: 10.1111/j.1600-0846.2008.00311.x.Skin Res Technol. 2008.PMID: 18937780