Conventional techniques for characterization of thermoelectric performance require bringing measurement equipment into direct contact with the thermoelectric device, which is increasingly error prone as device size decreases. Therefore, the novel work presented here describes a non-contact technique, capable of accurately measuring the maximum ΔT and maximum heat pumping of mini to micro sized thin film thermoelectric coolers. The non-contact characterization method eliminates the measurement errors associated with using thermocouples and traditional heat flux sensors to test small samples and large heat fluxes. Using the non-contact approach, an infrared camera, rather than thermocouples, measures the temperature of the hot and cold sides of the device to determine the device ΔT and a laser is used to heat to the cold side of the thermoelectric module to characterize its heat pumping capacity. As a demonstration of the general applicability of the non-contact characterization technique, testing of a thin film thermoelectric module is presented and the results agree well with those published in the literature.